Radiant energy – Invisible radiant energy responsive electric signalling – Semiconductor system
Reexamination Certificate
2007-01-30
2007-01-30
Porta, David (Department: 2884)
Radiant energy
Invisible radiant energy responsive electric signalling
Semiconductor system
C257S428000, C438S057000, C438S119000
Reexamination Certificate
active
10400381
ABSTRACT:
The radiation detector/imaging substrate arrays in an x-ray and gamma-ray radiation energy imaging device are described which use an electrically conductive adhesive to provide electron charge signaling continuity between the detector and read-out substrates of the device. The present device utilizes a plurality of electrically conductive bonds each discretely connecting a pixel contact in the pixel pattern to a signal contact in the signal contact pattern, the bonds being an electrically conductive adhesive. This bonding technique is especially useful in detection/imaging arrays having detector substrates comprising Cadmium and Tellurium compositions. The present invention is practicable with semiconductor detector and read-out substrates with or without “bumped” electrical contacts. The electrically conductive bonds utilize either isotropically or anisotropically conductive adhesives.
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Vuorela, M., Holloway, M., Fuchs, S., Stam, F., Kivilahti, J. “Bismuth-filled anisotropically conductive adhesive for flip chip bonding.” Proc. of the 4thInt'l Conf. on Adhesive Joining and Coating Technology in Electronics Manufacturing. Jun. 18-21, 2000. pp. 147-152.
Moetteli & Associates
Oy Ajat Ltd.
Porta David
Rosenberger Frederick F.
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