Conductive adhesive and circuit using the same

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428206, 428328, 428414, 428416, 428901, 523200, 523210, 523427, 523442, 525474, 525481, 525489, 25251914, 25251921, 25251933, 25251934, 2525212, 2525215, 156330, B32B 3300, H01B 106

Patent

active

057142386

ABSTRACT:
There is disclosed a conductive adhesive comprising
(A) conductive particles having a surface of at least one of nickel and nickel-boron alloy, and the surface of which has been subjected to surface treatment with a mixture of a polyoxyalkylene phosphate compound and a polyoxyalkylenealkyl or polyoxyalkylenealkenyl amine or a derivative thereof;
(B) an epoxy compound which contains a diglycidyl epoxy compound used as a reactive diluent in an amount of 20 to 70 weight % based on the total amount of the epoxy compound; and
(C) a phenolic resin hardener which contains at least one of an alkyl resol phenolic resin and alkyl novolak phenolic resin in an amount of 50% by weight or more based on the total amount of the phenolic resin hardener.

REFERENCES:
patent: 1427786 (1922-09-01), Deaton
patent: 1911397 (1933-05-01), Saurbrey
patent: 2329993 (1943-06-01), Kriner
patent: 2560853 (1951-04-01), Eickmeyer et al.
patent: 2671554 (1954-11-01), Melroe
patent: 2742670 (1956-09-01), Morin
patent: 2771929 (1956-01-01), Alterio et al.
patent: 3359145 (1967-12-01), Salyer et al.
patent: 5166229 (1992-11-01), Nakano et al.

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