Conduction cooled module

Details Conduction cooled module Conduction cooled module

1978-06-29

1980-03-18

Richter, Sheldon

Heat exchange

With repair or assembly means

Positioner or retainer for settable material

165 80B, 165 80C, 165185, 361387, H01L 2342

Patent

active

041934458

ABSTRACT:
An improved conduction cooled module of the type having at least one chip mounted on a substrate and having a housing surrounding the chips and sealed to the substrate. The housing having cylinders therein opposite the chips for containing pistons which are resiliently urged against the chip surface. Each piston has an opening extending from the top to the bottom surface and has at least one circumferential groove located in the outer wall of the piston. The opening and circumferential grooves are preloaded with a low melt point heat conductive material which is reflowed after assembly into the module to fill the interfaces formed between the piston and chip and the piston and cylinder. Grooves are located in the piston walls forming the interfaces which facilitate the flow of the molten material into the interfaces.

REFERENCES:
patent: 2928162 (1960-03-01), Marinale
patent: 3199000 (1965-08-01), Nippert
patent: 3993123 (1976-11-01), Chu et al.
patent: 4069498 (1978-01-01), Joshi
Technique for Heat-Sinking to Lower K, Bowers et al., IBM Technical Disclosure Bulletin, vol. 4, No. 10, Mar. 1962, p. 53.
Structural Concept for Module with Improved Heat Transfer Characteristics, Arnold et al., IBM Technical Disclosure Bulletin, vol. 20, No. 6, Dec. 1977, pp. 2675-2676.
Design for Providing Thermal Interface Material Between Narrow Thermal Interface Gaps, Chu, IBM Technical Disclosure Bulletin, vol. 20, No. 7, Dec. 1977, pp. 2761-2762.
Solid Encapsulated Module, Chu et al., IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, pp. 2435-2436.

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