Conducting material and a method of fabricating thereof

Details Conducting material and a method of fabricating thereof Conducting material and a method of fabricating thereof

1991-01-09

1992-02-11

Stoll, Robert L.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Making composite or hollow article

419 8, 419 22, 419 23, 419 33, 419 36, 419 35, 419 45, 428901, 428137, 428209, 428426, 428433, B23F 700

Patent

active

050874136

ABSTRACT:
Vias each having no pore are formed in a multilayer ceramic substrate by filling through holes of green sheets with conducting material obtained by: kneading mixed powder particles, the powder particles produced by adding copper oxide powder particles in the amount of 50% (in weight) or less to copper powder particles, with a solution including methyl ethyl ketone and 0.5% (in weight) of isosulfonyltridecylbenzene titanate; drying and cracking the kneaded mixed powder particles, producing cracked mixed powder particles; classifying the cracked mixed powder particles with a 100 mesh filter, producing classified mixed powder particles; spheroidizing the classified mixed powder particles with a collision method performed in gases flowing at high speed; and firing the green sheets at a temperature of about 800.degree. C.

REFERENCES:
patent: 3852877 (1974-12-01), Ahn et al.
patent: 4024629 (1977-05-01), Lemoine et al.
patent: 4434134 (1984-02-01), Darrow et al.
patent: 4599277 (1986-07-01), Brownlow et al.
patent: 4671928 (1987-06-01), Herron et al.
patent: 4868034 (1989-09-01), Steinberg
patent: 4954313 (1990-09-01), Lynch
patent: 4961879 (1990-10-01), Moy et al.

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