Conducting material and a method of fabricating thereof

Details Conducting material and a method of fabricating thereof Conducting material and a method of fabricating thereof

1991-01-09

1992-01-14

Ryan, Patrick J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

428195, 428209, 428137, 428901, 427 79, B32B 900

Patent

active

050809660

ABSTRACT:
Vias each having no pore are formed in a multilayer ceramic substrate by filling through holes of green sheets with conducting material obtained by: kneading mixed powder particles, adding copper oxide powder particles 50% (in weight) or less to copper powder particles, with a solution including methyl ethyl ketone and 0.5% (in weight) of isosulfonyltridecylbenzene titanate; drying and cracking the kneaded mixed powder particles, producing cracked mixed powder particles; classifying the cracked mixed powder particles with a 100 mesh filter, producing classified mixed powder particles; spheroidizing the classified mixed powder particles with a collision method performed in gases flowing at high speed; and firing the green sheets at a temperature of about 800.degree. C.

REFERENCES:
patent: 4460622 (1984-07-01), Yamaoka et al.

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