Conducive, silicone-based compositions with improved initial...

Details Conducive, silicone-based compositions with improved initial... Conducive, silicone-based compositions with improved initial...

2005-04-26

2005-04-26

Robertson, Jeffrey B. (Department: 1712)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C252S500000, C252S512000, C252S514000, C252S518100, C252S519310, C252S519500, C252S519510, C252S519540, C252S520200, C252S520210, C252S520300, C252S521100, C252S521300, C523S220000, C524S430000, C524S431000, C524S432000, C524S433000, C524S434000, C524S436000, C524S437000, C524S492000, C524S493000, C524S588000

Reexamination Certificate

active

06884314

ABSTRACT:
The present invention relates generally to conductive, silicone-based compositions, with improved initial adhesion and reduced micro-voiding. More specifically, the present invention relates to a conductive, silicone-based composition, which includes a polyorganosiloxane, a silicone resin, and a conductive filler component.

REFERENCES:
patent: 5569684 (1996-10-01), Okami et al.
patent: 6124483 (2000-09-01), Fan et al.
patent: 6534581 (2003-03-01), Kleyer et al.
patent: 44 945 (1966-12-01), None
patent: 07-292251 (1995-11-01), None
patent: WO 0228849 (2002-11-01), None

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