Conditioning ring for use in a chemical mechanical polishing mac

Details Conditioning ring for use in a chemical mechanical polishing mac Conditioning ring for use in a chemical mechanical polishing mac

1996-12-17

2000-10-31

Scherbel, David A.

Abrading

Attachment

To lathe

451286, 451288, 451 56, 451443, B24B 100

Patent

active

061394289

ABSTRACT:
The present invention is a conditioning ring for conditioning a polishing pad in a chemical-mechanical polishing machine. The conditioning ring is comprised of a ring having a diameter and a conditioning surface substantially parallel to a plane defined by the diameter. The conditioning ring has an inner radius surface to the plane defined by the diameter, wherein the inner radius surface is adapted to accept a wafer. The conditioning ring has an outer radius surface opposite the inner radius surface and an upper surface opposite the conditioning surface. The chemical mechanical polishing machine polishes the wafer by moving the polishing pad with respect to the wafer while the wafer is in contact with the polishing pad. The conditioning surface is adapted to frictionally contact the polishing pad. The conditioning surface conditions the polishing pad in response to a down force applied to the conditioning ring and as the chemical-mechanical polishing machine moves the polishing pad in relation to the conditioning surface.

REFERENCES:
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5681212 (1997-10-01), Hayakawa et al.
patent: 5695392 (1997-12-01), Kim
patent: 5749771 (1998-05-01), Isobe
patent: 5916412 (1999-06-01), Nakashiba et al.

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