Conditioning polishing pad for chemical-mechanical polishing

Details Conditioning polishing pad for chemical-mechanical polishing Conditioning polishing pad for chemical-mechanical polishing

2006-05-23

2006-05-23

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

C451S005000, C451S285000, C451S041000, C323S280000

Reexamination Certificate

active

07048610

ABSTRACT:
In one embodiment, a CMP pad is conditioned by repeatedly cycling the CMP pad between a first temperature and a second temperature higher than the first temperature to eliminate at least one crystalline area in the CMP pad.

REFERENCES:
patent: 5225766 (1993-07-01), O'Neill
patent: 2002/0052174 (2002-05-01), Nishimura et al.
patent: 2003/0104769 (2003-06-01), Brunelli
patent: 2005/0003738 (2005-01-01), He
patent: 2005/0101228 (2005-05-01), Prasad
patent: 2005/0148185 (2005-07-01), Hirabayashi et al.
patent: 2005/0170760 (2005-08-01), Homma et al.

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