Conditioning of polyamides for electroless plating

Details Conditioning of polyamides for electroless plating Conditioning of polyamides for electroless plating

1980-12-22

1982-06-15

Morgenstern, Norman

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427305, 427306, 427307, 427444, 156668, B05D 310

Patent

active

043351646

ABSTRACT:
Polyamide substrates are pre-conditioned for electroless plating by contact with an aqueous alkaline solution having a pH of at least about 10 and etched with an aqueous acid etch solution of an organic acid containing at least two carbon atoms, in combination with from 1 to 10 percent by weight of an inorganic acid which is nondeleteriously reactive with the organic acid. Trichloroacetic acid is the preferred organic acid and sulfuric, hydrochloric and/or nitric the preferred inorganic acids. Contact with the aqueous alkaline solution can be eliminated where the polyamide is caprolactam.

REFERENCES:
patent: 3574070 (1971-04-01), Sahely
patent: 3686017 (1972-08-01), Menikheim et al.
patent: 4125649 (1978-11-01), Donovan
patent: 4227963 (1980-10-01), Wiggins

Affiliated with

Also associated with

Rating

Conditioning of polyamides for electroless plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conditioning of polyamides for electroless plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conditioning of polyamides for electroless plating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1919437