Conditioning of polyamides for electroless plating

Details Conditioning of polyamides for electroless plating Conditioning of polyamides for electroless plating

1980-06-16

1982-02-09

Lusignan, Michael R.

Coating processes

With pretreatment of the base

Etching, swelling, or dissolving out part of the base

156628, 156668, 427304, 427305, 427306, 427444, B05D 310

Patent

active

043150454

ABSTRACT:
Polyamide substrates are pre-conditioned for electroless plating by contact with an alkaline aqueous solution having a pH of at least about 10 and etched with an aqueous acid etch solution. The aqueous acid etch solution is preferably an aqueous solution of an organic acid containing at least two carbon atoms, particularly an acetic acid compound, such as trichloroacetic acid.

REFERENCES:
patent: 3574070 (1971-04-01), Sahely
patent: 3686017 (1972-08-01), Menikheim et al.
patent: 4084023 (1978-04-01), Dafter
patent: 4125649 (1978-11-01), Donovan
patent: 4131698 (1978-12-01), Deckert

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