Conditioning of a substrate for electroless direct bond plating

Details Conditioning of a substrate for electroless direct bond plating Conditioning of a substrate for electroless direct bond plating

1982-07-14

1984-10-23

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427304, 427305, 427306, C23C 302

Patent

active

044788835

ABSTRACT:
A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and/or on the surfaces of the substrate.

REFERENCES:
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patent: 3844799 (1974-10-01), Underkofler
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patent: 4066809 (1978-01-01), Alpaugh
patent: 4152467 (1979-05-01), Alpaugh
patent: 4244789 (1981-01-01), Coll-Palagos
patent: 4301190 (1981-11-01), Feldstein

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