Conditioning a dielectric substrate for plating thereon

Details Conditioning a dielectric substrate for plating thereon Conditioning a dielectric substrate for plating thereon

1986-12-15

1990-03-20

Beck, Shrive

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427 98, 427304, 437230, 156279, 1563073, B05D 304

Patent

active

049100491

ABSTRACT:
A dielectric substrate is conditioned for plating from an electroless metal plating bath by providing the surface or surfaces of the substrate that are to be plated with semiconductor material whereby the semiconductor material, in the case of n-type material, exhibits energy band where the valence band is equal to or higher than and, in the case of p-type material, exhibits energy band where the valence band is equal to or lower than the redox potential of the metallic ions in the electroless plating bath that are to be deposited as metal on the substrate.

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