Condition optimization method for measuring overlay accuracy of

Details Condition optimization method for measuring overlay accuracy of Condition optimization method for measuring overlay accuracy of

1993-09-03

1995-11-21

Rosasco, S.

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

430 5, 430 30, 355 53, G03F 900

Patent

active

054685800

ABSTRACT:
A method of optimizing measurement conditions of an overlay metrology system without etching process, and this method comprising the steps of forming a first overlay measurement pattern formed of first measurement marks and a second overlay measurement pattern formed of second measurement marks on a substrate, measuring an overlay deviation amount between the first measuring mark and the second measurement mark by the overlay metrology system, calculating an overlay deviation amount difference by subtracting a predetermined overlay deviation amount from respective overlay deviation amounts and adjusting measurement conditions of the overlay metrology system such that a fluctuation of the overlay deviation amount difference is minimized.

REFERENCES:
patent: 4985634 (1991-01-01), Stengl et al.
patent: 5283141 (1994-02-01), Yoon et al.

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