Condenser microphone and method for manufacturing substrate...

Details Condenser microphone and method for manufacturing substrate... Condenser microphone and method for manufacturing substrate...

2007-05-29

2007-05-29

Harvey, James R. (Department: 2833)

Electrical connectors

Metallic connector or contact having part permanently...

Adapted to be secured to conductor formed on printed circuit...

Reexamination Certificate

active

11262093

ABSTRACT:
A substrate is obtained as follows. A structure is formed using a metal plate for a lead frame on which terminals and connection portions are formed; the terminals are exposed from either a front or back surface and the connection portions connect the terminals together. A resin is then used to make the structure hard. The height of a step in a central step portion is variable. The resin is one of PA6T, PPS, and LCP, all of which are resistant to heat. A step portion can be obtained which projects from a bottom surface of a circuit substrate. The circuit substrate is inexpensively obtained.

REFERENCES:
patent: 4340915 (1982-07-01), Nakamura et al.
patent: 2006/0093168 (2006-05-01), Yamamoto et al.
patent: 2006/0104468 (2006-05-01), Yamamoto et al.
patent: 2006/0137455 (2006-06-01), Yasuda et al.
patent: 2006/0205244 (2006-09-01), Shigeno et al.
patent: 2003-153392 (2003-05-01), None

Affiliated with

Also associated with

Rating

Condenser microphone and method for manufacturing substrate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Condenser microphone and method for manufacturing substrate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Condenser microphone and method for manufacturing substrate... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3756880