Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-06-25
2011-11-15
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S702000, C361S703000, C361S679530, C165S104330
Reexamination Certificate
active
08059405
ABSTRACT:
Condenser structures and cooling apparatuses are provided which facilitate vapor condensation heat transfer of a coolant employed in cooling an electronic device. The condenser structure includes a thermally conductive condenser block with multiple exposed cavities therein extending from a first main surface towards a second main surface. The condenser block is a monolithic structure, and the first main surface is a coolant vapor condensate formation surface when the condenser structure is operationally facilitating cooling of an electronic device. The exposed cavities extend from the first main surface into the condenser block to increase a condensation surface area of the condenser block, thereby facilitating coolant vapor condensate formation on the condenser block, and thus cooling of the electronic device using a two-phase coolant. The condenser structure also includes coolant-carrying channels for facilitating cooling of the condenser block, and thus vapor condensate formation on the condenser block.
REFERENCES:
patent: 2643282 (1953-06-01), Greene
patent: 2942165 (1960-06-01), Jackson et al.
patent: 3109485 (1963-11-01), Fortier
patent: 3222580 (1965-12-01), Curll
patent: 3616533 (1971-11-01), Heap et al.
patent: 4064300 (1977-12-01), Bhangu
patent: 4108242 (1978-08-01), Searight et al.
patent: 4201195 (1980-05-01), Sakhuja
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4622946 (1986-11-01), Hurley et al.
patent: 4750086 (1988-06-01), Mittal
patent: 4833567 (1989-05-01), Saaski et al.
patent: 5006924 (1991-04-01), Frankeny et al.
patent: 5063476 (1991-11-01), Hamadah et al.
patent: 5126919 (1992-06-01), Yamamoto et al.
patent: 5168919 (1992-12-01), Berenholz et al.
patent: 5183104 (1993-02-01), Novotny
patent: 5220804 (1993-06-01), Tilton et al.
patent: 5308920 (1994-05-01), Itoh
patent: 5349831 (1994-09-01), Daikiku et al.
patent: 5351748 (1994-10-01), Dagan
patent: 5411077 (1995-05-01), Tousignant
patent: 5508884 (1996-04-01), Brunet et al.
patent: 5608610 (1997-03-01), Brzezinski
patent: 5634351 (1997-06-01), Larson et al.
patent: 5718117 (1998-02-01), McDunn et al.
patent: 5720338 (1998-02-01), Larson et al.
patent: 5726495 (1998-03-01), Aihara et al.
patent: 5781411 (1998-07-01), Feenstra
patent: 5854092 (1998-12-01), Root et al.
patent: 5963425 (1999-10-01), Chrysler et al.
patent: 6000908 (1999-12-01), Bunker
patent: 6134108 (2000-10-01), Patel et al.
patent: 6134783 (2000-10-01), Bargman et al.
patent: 6193905 (2001-02-01), Yamada et al.
patent: 6237223 (2001-05-01), McCullough
patent: 6366462 (2002-04-01), Chu et al.
patent: 6378605 (2002-04-01), Kutscher et al.
patent: 6431260 (2002-08-01), Agonafer et al.
patent: 6474074 (2002-11-01), Ghoshal
patent: 6490160 (2002-12-01), Dibene et al.
patent: 6519151 (2003-02-01), Chu et al.
patent: 6549408 (2003-04-01), Berchowitz
patent: 6550263 (2003-04-01), Patel et al.
patent: 6550531 (2003-04-01), Searls et al.
patent: 6571569 (2003-06-01), Rini et al.
patent: 6817196 (2004-11-01), Malone et al.
patent: 6817405 (2004-11-01), Kamath et al.
patent: 6918435 (2005-07-01), Dwyer
patent: 6926071 (2005-08-01), Lee et al.
patent: 6938678 (2005-09-01), Bortolini et al.
patent: 6938680 (2005-09-01), Garner et al.
patent: 6992888 (2006-01-01), Iyer
patent: 7077189 (2006-07-01), Reyzin et al.
patent: 7079393 (2006-07-01), Colgan et al.
patent: 7134289 (2006-11-01), Patel et al.
patent: 7254030 (2007-08-01), Chiba et al.
patent: 7284389 (2007-10-01), Sharma et al.
patent: 7307841 (2007-12-01), Berlin et al.
patent: 7349213 (2008-03-01), Campbell et al.
patent: 7357173 (2008-04-01), Griesmayer
patent: 7362574 (2008-04-01), Campbell et al.
patent: 7365981 (2008-04-01), Myers et al.
patent: 7369410 (2008-05-01), Chen et al.
patent: 7375962 (2008-05-01), Campbell et al.
patent: 7380409 (2008-06-01), Campbell et al.
patent: 7450385 (2008-11-01), Campbell et al.
patent: 7477513 (2009-01-01), Cader et al.
patent: 7495914 (2009-02-01), Tilton et al.
patent: 7522422 (2009-04-01), Chiba et al.
patent: 2001/0006101 (2001-07-01), Chu et al.
patent: 2002/0062945 (2002-05-01), Hocker et al.
patent: 2002/0118511 (2002-08-01), Dujari et al.
patent: 2003/0205363 (2003-11-01), Chu et al.
patent: 2004/0246683 (2004-12-01), Honsberg-Riedl et al.
patent: 2006/0039111 (2006-02-01), Huang
patent: 2006/0118280 (2006-06-01), Liu
patent: 2006/0162365 (2006-07-01), Hoang et al.
patent: 2006/0191675 (2006-08-01), Fletcher et al.
patent: 2006/0196640 (2006-09-01), Siu
patent: 2007/0133173 (2007-06-01), Hsiung et al.
patent: 2007/0201210 (2007-08-01), Chow et al.
patent: 2007/0258213 (2007-11-01), Chen et al.
patent: 2008/0002363 (2008-01-01), Campbell et al.
patent: 2008/0225478 (2008-09-01), Goettert et al.
patent: 2009/0284918 (2009-11-01), Chou
patent: 2009/0284927 (2009-11-01), Li et al.
patent: 2010/0326628 (2010-12-01), Campbell et al.
patent: 2010/0328882 (2010-12-01), Campbell et al.
patent: 2010/0328889 (2010-12-01), Campbell et al.
patent: 2010/0328890 (2010-12-01), Campbell et al.
patent: 8-254512 (1996-10-01), None
patent: 09-116056 (1997-05-01), None
patent: 2002-026201 (2002-01-01), None
patent: 319406 (1997-11-01), None
Notice of Allowance for U.S. Appl. No. 12/491,281 (U.S. Patent Publication No. 2010/0328889 A1), dated Feb. 11, 2011.
Notice of Allowance for U.S. Appl. No. 12/491,287 (U.S. Patent Publication No. 2010/0328890 A1), dated Feb. 16, 2011.
Iyengar et al., “Apparatus and Method for Facilitating Cooling of an Electronics System”, U.S. Appl. No. 11/957,619, filed Dec. 17, 2007.
Chu et al., “Energy Efficient Apparatus and Method for Cooling and Electronics Rack”, U.S. Appl. No. 12/108,020, filed Apr. 23, 2008.
Campbell et al., “Suspended Integrated Manifold System with Serviceability for Large Planar Arrays of Electronic Modules”, IBM Technical Disclosure, IP.com, IP.com No. IPCOM000126455D (Jul. 18, 2005).
Chee, B., “Supermicro Water Cooled Blades”, Info World, Geeks in Paradise, (Mar. 5, 2008), http://weblog.infoworld.com/geeks/archives/2008/03.
Campbell et al., “Liquid Cooling Apparatus and Method of Facilitating Cooling of an Electronic System”, U.S. Appl. No. 12/168,259, filed Jul. 7, 2008.
Ellsworth, Jr., et al., “System and Method for Facilitating Cooling of a Liquid-Cooled Electronics Rack”, U.S. Appl. No. 11/942,207, filed Nov. 19, 2007.
Campbell et al., “Hybrid Air and Liquid Coolant Conditioning Unit for Facilitating Cooling of One or More Electronics Racks of a Dada Center”, U.S. Appl. No. 11/944,680, filed Nov. 26, 2007.
Campbell et al., “Method and Apparatus for Defect Detection in a Cold Plate”, U.S. Appl. No. 12/053,762, filed Mar. 24, 2008.
Campbell et al., “Cooling Apparatus and Method of Fabrication Thereof with Jet Impingement Structure Integrally Formed on Thermally Conductive Pin Fins”, U.S. Appl. No. 12/141,290, filed Jun. 18, 2008.
Campbell et al., “Cooling Apparatus and Method of Fabrication Thereof with a Cold Plate Formed In Situ on a Surface to be Cooled”, U.S. Appl. No. 12/143,289, filed Jun. 20, 2008.
Campbell et al., “Apparatus and Method for Facilitating Pumped Immersion-Cooling of an Electronic Subsystem”, U.S. Appl. No. 12/256,628, filed Oct. 23, 2008.
Office Action for U.S. Appl. No. 12/491,287, dated Aug. 19, 2010.
Notice of Allowance for U.S. Appl. No. 12/491,289, dated Aug. 27, 2010.
Office Action for U.S. Appl. No. 12/491,281, dated Oct. 7, 2010.
Office Action for U.S. Appl. No. 12/491,287, dated Nov. 30, 2010.
Campbell Levi A.
Chu Richard C.
Ellsworth, Jr. Michael J.
Iyengar Madhusudan K.
Simons Robert E.
Heslin Rothenberg Farley & Mesiti P.C
International Business Machines - Corporation
Jung, Esq. Dennis
Radigan, Esq. Kevin P.
Vortman Anatoly
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