Condensed memory matrix

Details Condensed memory matrix Condensed memory matrix

1998-10-20

2000-06-06

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438106, 438460, 438464, H01L 2144, H01L 2148, H01L 2150

Patent

active

060717572

ABSTRACT:
A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curable resin. An array of heat fins is bonded to the inactive surface of the wafer by a thermally conductive curable resin.

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patent: 5229647 (1993-07-01), Gnadinger
patent: 5249101 (1993-09-01), Frey et al.
patent: 5629630 (1997-05-01), Thompson et al.
patent: 5685885 (1997-11-01), Khandros et al.
patent: 5824177 (1998-10-01), Yoshihara et al.

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