Condensation soldering facility

Details Condensation soldering facility Condensation soldering facility

1978-03-13

1980-02-12

Moon, Charlie T.

Metal fusion bonding

Process

Preplacing solid filler

165105, 219439, B23K 300

Patent

active

041879740

ABSTRACT:
A first vessel is mounted within and spaced from a second vessel. A primary heat transfer liquid is introduced into the first vessel and a secondary heat transfer liquid introduced into the second vessel. Heating coils immersed in the secondary heat transfer liquid are energized to boil the secondary liquid to form a body of secondary vapor, a portion of which condenses on the outer surface of the first vessel to heat said vessel and boil the primary liquid therein to form a body of primary vapor. An article having previously applied solder thereon is immersed in said body of primary vapor and the solder caused to melt and flow due to the latent heat of vaporization transferred thereto by the primary vapor condensing thereon. Additionally, a tertiary body of vapor is formed above the primary vapor to substantially preclude the loss of the primary vapor to the atmosphere.

REFERENCES:
patent: 3609297 (1971-09-01), Christopoulos
patent: 3746079 (1973-07-01), Arenson
patent: 3823307 (1974-07-01), Weiss
patent: 3866307 (1975-02-01), Pfahl, Jr. et al.
patent: 3904102 (1975-09-01), Chu et al.
patent: 3947240 (1976-03-01), Pfahl, Jr.
patent: 3967093 (1976-06-01), Oi
patent: 4077467 (1978-03-01), Spigarelli

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