Concept of compensating for piezo influences on integrated...

Data processing: measuring – calibrating – or testing – Calibration or correction system – Circuit tuning

Reexamination Certificate

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C324S251000, C324S252000, C327S511000, C323S293000, C323S294000, C073S001150, C073S001480, C073S035110, C073S035130, C073S721000, C073S727000

Reexamination Certificate

active

07440861

ABSTRACT:
The inventive circuitry on a semiconductor chip includes a first functional element having a first electronic functional-element parameter that exhibits a dependence relating to the mechanical stress present in the semiconductor circuit chip in accordance with a first functional-element stress influence function. The first functional element provides a first output signal based on the first electronic functional-element parameter and mechanical stress. A second functional element has a second electronic functional-element parameter that exhibits a dependence in relation to the mechanical stress present in the semiconductor circuit chip in accordance with a second functional-element stress influence function. The second functional element is configured to provide a second output signal based on the second electronic functional-element parameter and the mechanical stress. A combiner combines the first and second output signals to obtain a resulting output signal exhibiting a predefined dependence on the mechanical stress present in the semiconductor circuit chip.

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