Concentrate for the electroless deposition of copper coatings on

Details Concentrate for the electroless deposition of copper coatings on Concentrate for the electroless deposition of copper coatings on

1997-02-18

1998-07-07

Utech, Benjamin

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, B22F 700

Patent

active

057762317

ABSTRACT:
Disclosed is a process for the electroless deposition of a copper coating on an iron or iron alloy surface wherein the workpiece surface is contacted with a solution which contains hydrogen ions, 5 to 30 g/l Cu as well as 0.2 to 5 g/l Mg and preferably copper and magnesium with a weight ratio of Cu:Mg of (35 to 5):1 for a treatment time of 3 sec to 15 min at a temperature of the solution of 20.degree. to 65.degree. C.
The invention also comprises a solid concentrate for preparing and replenishing the solution for carrying out the process, which consists of at least 85 wt-% CuSO.sub.4.5H.sub.2 O and MgSO.sub.4 (anhydrous) with a weight ratio of (35 to 5):1, and preferably contains in addition a maximum of 10 wt-% polyglycol and a maximum of 5 wt-% sodium chloride.

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