Concave soldering iron tip and method of soldering using same

Metal fusion bonding – Metallic heat applicator – With means to handle flux or filler

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228 54, 219229, B23K 100, H05K 334

Patent

active

053321448

ABSTRACT:
In accordance with a preferred embodiment of the present invention, a concavity of an elliptical shape is formed in a chisel-shaped soldering tip to create a reservoir in which a quantity of molten solder is retained by surface tension. In a preferred method of use, the leads of an electronic component and the lands of a circuit board to which they are to be electrically connected are pretreated with flux. The tip, with a blob of solder in its concavity, is drawn along the lead/land region with the blob of molten solder making contact therewith, so that molten solder is wicked into the region, and joints are formed between the leads the lands.

REFERENCES:
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patent: 3315350 (1967-04-01), Kent
patent: 3580462 (1971-05-01), Vanyi
patent: 4648545 (1987-03-01), Polckemann
patent: 4699308 (1987-10-01), Wigley et al.
patent: 4936501 (1990-06-01), Babarin
patent: 5127572 (1992-07-01), Pazhouhesh et al.
Pace, Inc., Tip Catalog for Sensatemp Systems, 1992.

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