Metal fusion bonding – Metallic heat applicator – With means to handle flux or filler
Patent
1993-03-17
1994-07-26
Heinrich, Samuel M.
Metal fusion bonding
Metallic heat applicator
With means to handle flux or filler
228 54, 219229, B23K 100, H05K 334
Patent
active
053321448
ABSTRACT:
In accordance with a preferred embodiment of the present invention, a concavity of an elliptical shape is formed in a chisel-shaped soldering tip to create a reservoir in which a quantity of molten solder is retained by surface tension. In a preferred method of use, the leads of an electronic component and the lands of a circuit board to which they are to be electrically connected are pretreated with flux. The tip, with a blob of solder in its concavity, is drawn along the lead/land region with the blob of molten solder making contact therewith, so that molten solder is wicked into the region, and joints are formed between the leads the lands.
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patent: 5127572 (1992-07-01), Pazhouhesh et al.
Pace, Inc., Tip Catalog for Sensatemp Systems, 1992.
Heinrich Samuel M.
Pace Incorporated
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