Concave face wire bond capillary and method

Details Concave face wire bond capillary and method Concave face wire bond capillary and method

2005-10-07

2008-08-26

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S004500

Reexamination Certificate

active

07416107

ABSTRACT:
An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

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