Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-08-30
2009-12-01
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S687000, C257S777000, C257SE25006, C257SE25013
Reexamination Certificate
active
07626253
ABSTRACT:
The present invention provides a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip (20) disposed on a substrate (10), a first sealing resin (26) sealing the first semiconductor chip (20), a built-in semiconductor device (30) disposed on the first sealing resin (26), and a second sealing resin (36) sealing the first sealing resin (26) and the built-in semiconductor device (30) and covering a side surface (S) of the substrate (10). According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized.
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Meguro Kouichi
Onodera Masanori
Tanaka Junji
Le Dung A.
Spansion LLC
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