Computer with thermal cooling and a thermal cooling system...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S701000, C361S707000, C361S714000

Reexamination Certificate

active

06501647

ABSTRACT:

BACKGROUND
The disclosures herein relates to a thermal cooling system and method for electronic devices, such as computers.
Many electronic devices, such as computers, contain heat generating devices, such as chips, processors, etc., that are disposed in a crowded area in the chassis of the device and thus cause an excessive amount of heat to accumulate in the chassis, which can cause failure of one or more of the devices.
Therefore, what is needed is a system and method for dissipating heat from a heat-generating device according to which a heat dissipating device exerts a relatively high, constant, uniform pressure on the heat generating device to ensure maximum heat transfer.
SUMMARY
One embodiment, accordingly, provides a clamp assembly that clamps the heat dissipating device to the heat generating device. The clamp assembly ensures that the heat dissipating device exerts a relatively high, constant, uniform pressure on the heat generating device to ensure maximum heat transfer from the heat generating device to the heat dissipating device.


REFERENCES:
patent: 5568360 (1996-10-01), Penniman et al.
patent: 5734550 (1998-03-01), Penniman et al.
patent: 5777852 (1998-07-01), Bell
patent: 6280222 (2001-08-01), Walkup

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