Computer system with heat sink having an integrated grounding ta

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

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Details

257726, 257727, 257712, 257719, 174 163, 361704, 361722, H05K 720, H01L 2334

Patent

active

058048758

ABSTRACT:
A method and apparatus for simultaneously coupling a heat sink to an electrical device and reducing electromagnetic interference caused by the heat sink being coupled to the electrical device. A mother board, as used in an electronic circuit, is situated so that an electrical pad is located proximate to a socket for receiving the electrical device. The electrical device is placed inside the socket, and further has the heat sink thermally coupled to a top surface thereof. The heat sink serves to dissipate any heat radiating from the electrical device into a surrounding air mass. A heat sink clip physically and electrically engages with the heat sink and physically engages with the socket, thereby securing the heat sink to the device and the device to the socket. The heat sink clip also includes a tab that, when the clip is engaged with the heat sink, is in electrical contact with the pad, which in turn is in contact with a ground power supply. As a result, any electromagnetic interference ("EMI") radiation emitting from the electrical device is dissipated through the clip and into the pad, and from there to the ground power supply.

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