Computer system having a highly efficient forced air cooling sub

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361687, 361695, 361697, 361715, 312236, 174 151, 174 161, 165121, 165146, 454184, 622592, 62404, 62407, H05K 720

Patent

active

060348704

ABSTRACT:
A computer system including a highly efficient forced air cooling subsystem is disclosed. The computer system includes an enclosure having a first (e.g., front) panel, a processor mounted upon a motherboard located within the enclosure, and a fan located within the enclosure for providing a flow of air through the enclosure. The fan draws air into the enclosure through an opening (e.g., an intake vent) in the first panel and produces a pressurized stream of air. The fan may be oriented such that the pressurized stream of air is directed toward the processor. The computer system may also include a plenum adjacent to the first panel, wherein the intake vent allows ambient air surrounding the enclosure to enter the plenum. The fan may be mounted within an opening in a wall of the plenum. The enclosure may also include a second (e.g., rear) panel opposed to the first (e.g., front) panel and having three openings (e.g., exhaust vents) therein. A first portion of the pressurized stream of air may flow across the processor and exit through a first exhaust vent. A second portion of the pressurized stream of air may flow through a power supply located within the enclosure and exit through a second exhaust vent. A third portion of the pressurized stream of air may flow through a space within the enclosure reserved for option cards and exit the enclosure through a third exhaust vent.

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Low Profile Fan Duct Design Guidelines, Intel Corporation, copyright 1998.

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