Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1990-07-20
1992-06-23
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439591, H01R 909
Patent
active
051238489
ABSTRACT:
An electrical backplane makes high density electrical connections with logic boards in a computer system. The electrical backplane is comprised of an assembly pressure connector and a connector interconnect board that connects the logic boards to external wiring. The assembly pressure connector has electrical contact bumps on its surfaces for making electrical connections with contact points on the surface of the logic boards. The assembly pressure connector prevents the permanent deformation of its electrical contact bumps by using resilient bumps. The resilient bumps are formed from the end portions of interconnecting wires extending through the assembly pressure connector. The interconnecting wires are bent in the shape of a leaf spring. Thus, the wires are compressed within the elastic range of their composing material and are not permanently deformed by the force applied to the assembly pressure connector.
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August Melvin C.
Massopust Daniel
Nebel Mary
Neumann Eugene F.
Pautsch Gregory
Abrams Neil
Cray Research Inc.
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