Computer processor/heat sink assembly having a dual direction ai

Details Computer processor/heat sink assembly having a dual direction ai Computer processor/heat sink assembly having a dual direction ai

1998-03-26

2000-05-16

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 257713, 361719, H05K 720

Patent

active

060645709

ABSTRACT:
A computer processor/heat sink assembly in which a heat sink is provided extending adjacent a processor or electrical component to be cooled. The heat sink has a plurality of spaced fins having openings therein and is positioned in an air flow path so that the air flows through the openings to dissipate heat from the processor to the air. The assembly can also be positioned in a second position in the air flow path so that the air flows between the fins to dissipate heat from the processor to the air.

REFERENCES:
patent: 5535094 (1996-07-01), Nelson
patent: 5630469 (1997-05-01), Butterbaugh
patent: 5634351 (1997-06-01), Larson et al.
patent: 5673029 (1997-09-01), Behl et al.
patent: 5673176 (1997-09-01), Penniman et al.
patent: 5828549 (1998-10-01), Gandre
patent: 5829515 (1998-11-01), Jeffries
patent: 5831847 (1998-11-01), Love
patent: 5841633 (1998-11-01), Huang

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