Computer integrated manufacturing control system for oxide...

Details Computer integrated manufacturing control system for oxide... Computer integrated manufacturing control system for oxide...

2006-04-18

2006-04-18

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

C084S085000

Reexamination Certificate

active

07029596

ABSTRACT:
A new method is provided that extends the process of automation of the CMP process by monitoring the in-line removal rate, by using methods of curve-fitting that enable a reduction in the frequency of monitoring the removal rate of the CMP process, by enhancing the life expectancy of the polishing pad thereby further reducing the frequency of the required Preventive Maintenance and by allowing for the polishing of non-standard lots of wafers.

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