Computer incorporating heat dissipator with hinged heat pipe arr

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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16510433, 174 152, 361700, 361704, H05K 720

Patent

active

060317167

ABSTRACT:
An arrangement and method for enhancing the cooling capacity of portable personal computers. More particularly, the arrangement is employed for increasing the cooling capacity of portable personal computers, particularly such as laptop or notebook computers, wherein the computer possesses a keyboard housing having the rear edge thereof hingedly connected with the bottom of an openable display unit or panel, and containing heat-generating computer electronics, from which heat is removed through the intermediary of heat pipes which are hingedly connected with at least one heat dissipator located in the display unit.

REFERENCES:
patent: 5313362 (1994-05-01), Hatada et al.
patent: 5588483 (1996-12-01), Ishida
patent: 5621613 (1997-04-01), Haley et al.
patent: 5646822 (1997-07-01), Bhatia et al.
Albert Yu, "The Future of Microprocessors", IEEE Micro, Dec. 1996, pp. 46-53.
Masataka Mochizuki, et al., "Hinged Heat Pipes For Cooling Notebook PCs", Thirteenth IEEE Semi-Therm.TM. Symposium, 1997, pp. 64-72.

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