Computer heat dissipating system

Details Computer heat dissipating system Computer heat dissipating system

2006-09-12

2006-09-12

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S695000, C361S689000, C165S122000, C454S184000

Reexamination Certificate

active

07106586

ABSTRACT:
A heat dissipating system provides a fast heat dissipating airflow stream inside a desktop computer and thereby greatly enhances the heat dissipating efficiency of the desktop computer. The computer heat dissipating system includes a computer chassis which has a circular opening bored on its front plate, a motherboard which has a thermal module including a front cooling fan and a set of chipsets heatsink module installed on its top surface, and a power supply with a cooling fan. The thermal module, the chipsets heatsink module, and the power supply are aligned along a single heat dissipating airflow stream. The external low temperature air first passes through the thermal module and removes the heat generated by the central processing unit, further flows into the chipsets heatsink module and removes the heat generated by the MCH chipsets and ICH chipsets, and finally enters into the power supply and removes the heat generated by the power supply. The cooling fan of the power supply further facilitates the exhaust of the heated airflow.

REFERENCES:
patent: 5505533 (1996-04-01), Kammersqard et al.
patent: 5793608 (1998-08-01), Winick et al.
patent: 5828549 (1998-10-01), Gandre et al.
patent: 5963424 (1999-10-01), Hileman et al.
patent: 6011689 (2000-01-01), Wrycraft
patent: 6034870 (2000-03-01), Osborn et al.
patent: 6215659 (2001-04-01), Chen
patent: 6359781 (2002-03-01), Hoss et al.
patent: 6504712 (2003-01-01), Hashimoto et al.
patent: 6678157 (2004-01-01), Bestwick
patent: 6704196 (2004-03-01), Rodriguez et al.
The Article: “Processor Option Cooling Kit For personal Computers”, IBM Technical Disclosure Bulletin, Nov. 1992, vol. 35, Issue 6, pp. 154-155.

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