Computer having a heat sink structure incorporated therein

Details Computer having a heat sink structure incorporated therein Computer having a heat sink structure incorporated therein

1996-03-01

1998-01-27

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

16510433, 174 152, 361700, 361719, H05K 720

Patent

active

057127620

ABSTRACT:
A computer having a heat sink structure incorporated therein provides efficient heat dissipation for heat generating components within the computer. In a preferred embodiment, a computer has a chassis, a circuit board with a heat generating device mounted thereon, and a structural member with a heat pipe disposed thereon. The heat pipe transfers heat from the heat generating device to a heat dissipating portion of the structural member. The structural member strengthens the chassis and provides convective transfer of the heat to the environment.

REFERENCES:
patent: 4503483 (1985-03-01), Basiulis
patent: 5383340 (1995-01-01), Larson
patent: 5471850 (1995-12-01), Cowans
patent: 5485671 (1996-01-01), Larson
patent: 5588483 (1996-12-01), Ishida
patent: 5598320 (1997-01-01), Toedtman

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