Computer enclosure

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S816000

Reexamination Certificate

active

07636244

ABSTRACT:
A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.

REFERENCES:
patent: 4319795 (1982-03-01), Klaus
patent: 4832349 (1989-05-01), Kawai et al.
patent: 4873022 (1989-10-01), Ogawa et al.
patent: 5008486 (1991-04-01), Terakawa et al.
patent: 5128835 (1992-07-01), Rudy et al.
patent: 5164542 (1992-11-01), Hart
patent: 5170009 (1992-12-01), Kadokura
patent: 5176853 (1993-01-01), Sarma et al.
patent: 5364196 (1994-11-01), Baitz et al.
patent: 5574625 (1996-11-01), Ohgami et al.
patent: 5666261 (1997-09-01), Aguilera
patent: 5676812 (1997-10-01), Kadokura
patent: 5687055 (1997-11-01), Miki
patent: 5731541 (1998-03-01), Bernd et al.
patent: 5946194 (1999-08-01), Dudas et al.
patent: 5953206 (1999-09-01), Jondrow
patent: 6125029 (2000-09-01), Sasaki et al.
patent: 6151207 (2000-11-01), Kim
patent: 6266240 (2001-07-01), Urban et al.
patent: 6303854 (2001-10-01), Papaleo et al.
patent: 6323418 (2001-11-01), Tiburtius et al.
patent: 6547252 (2003-04-01), Kahl et al.
patent: 6574096 (2003-06-01), Difonzo et al.
patent: 6624353 (2003-09-01), Gabower
patent: 7046507 (2006-05-01), Nakamura et al.
patent: 7385806 (2008-06-01), Liao
patent: 2001/0015005 (2001-08-01), Chung et al.
patent: 99/47993 (1999-09-01), None
Fujitsu, “Fujitsu Introduces Intertop CS3000, New Windows CE Handheld PC”, Japanese Press Release, May 18, 1999, 3 pages.
IBM, “IBM Introduces the ThinkPad A Series and ThinkPad T Series,” Research Triangle Park, N.C., U.S., May 1, 2000, 3 pages.
PCT International Search Report for PCT Int'l Appln. No. US 01/42362 mailed Dec. 20, 2002, 7 pages.
“Be 6 Dispenser Material”, APM Bavaria GmbH, 1999.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Computer enclosure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Computer enclosure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Computer enclosure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4067256

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.