Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-12-15
2009-02-17
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S697000, C174S016100, C174S016300, C165S080300
Reexamination Certificate
active
07492590
ABSTRACT:
A computer enclosure includes an airflow guide (10), a chassis (20) for mounting the airflow guide therein, a fan30mounted in the airflow guide, and a side panel (27) for covering the chassis. The chassis includes a rear panel (25) and a motherboard (21) mounted therein, a heat sink (23) is mounted on the motherboard, a plurality of openings (253) for dissipating heat and a fixing slot (251) are defined in the rear panel. The fan aligns with an area of the openings of the rear panel. The airflow guide encases the heat sink therein and includes a catch (1371) engaging in the fixing slot of the chassis. The side panel covers the chassis and abuts against the airflow guide for preventing the catch disengaging from the fixing slot.
REFERENCES:
patent: 6215659 (2001-04-01), Chen
patent: 6343011 (2002-01-01), Yu
patent: 6400568 (2002-06-01), Kim et al.
patent: 6464578 (2002-10-01), Chin et al.
patent: 6587335 (2003-07-01), Nelson et al.
patent: 6643131 (2003-11-01), Huang
patent: 6657863 (2003-12-01), Lee et al.
patent: 6736196 (2004-05-01), Lai et al.
patent: 6826048 (2004-11-01), Dean et al.
patent: 6930882 (2005-08-01), Broder et al.
patent: 6951446 (2005-10-01), Hung
patent: 7050300 (2006-05-01), Hein
patent: 7254021 (2007-08-01), Lee et al.
patent: 7256993 (2007-08-01), Cravens et al.
patent: 7261516 (2007-08-01), Liang et al.
patent: 7310228 (2007-12-01), Chen
patent: 2006/0181846 (2006-08-01), Farmsworth et al.
patent: 2007/0058341 (2007-03-01), Hsiao
patent: 2008/0062641 (2008-03-01), Lai et al.
Chen Yun-Lung
Xiao Yu-Ming
Chervinsky Boris L
Chung Wei Te
Hon Hai Precision Industry Co. Ltd.
Hong Fu Jin Pecision Industry (ShenZhen) Co., Ltd.
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