Metal working – Barrier layer or semiconductor device making
Patent
1989-01-26
1991-08-27
Chadhuri, Olik
Metal working
Barrier layer or semiconductor device making
228 51, 7386302, 198341, H01L 2156, H01L 2158, H01L 2160
Patent
active
050421239
ABSTRACT:
An apparatus for producing semiconductor devices includes: a wafer splitting device for splitting a semiconductor wafer into individual dice; an automatic warehouse for lead frames for storing a plurality of kinds of lead frame; an assembly device for assembling a die and a lead frame into a semiconductor device; an automatic die/lead frame transport device for transporting the dice split by the splitting device and lead frames stored in the automatic warehouse to the assembly device; and a computer for controlling the automatic die/lead frame transport device to transport the lead frames of the type and quantity corresponding to the dice split by the splitting device, from the automatic warehouse to the assembly devices. The computer compares the number of non-defective dice with a predetermined production quantity and ensures that a sufficient quantity of non-defective dice to satisfy the production quantity are split and transported to the assembly device. This apparatus is suitable for producing a large variety of semiconductor devices in small lots on an automated continuous basis.
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"Disco Shinkawa Assembly Automation", Shinkawa Ltd.
Chadhuri Olik
Graybill David E.
Mitsubishi Denki & Kabushiki Kaisha
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