Computer component cooling system with local evaporation of refr

Refrigeration – Structural installation – With electrical component cooling

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Details

16510433, 361700, F25D 2312

Patent

active

053657497

ABSTRACT:
A cooling system for a computer system which includes at least one component which generates substantial thermal energy. The cooling system includes a heat exchanger formed of a thermally conductive material which is attached to the heat generating component, the heat exchanger including an internal expansion chamber. A first conduit provides a pressurized liquid refrigerant supplied from a refrigeration compressor unit to the expansion chamber, wherein the pressurized liquid refrigerant is evaporated absorbing heat from the heat exchanger and the attached heat generating component. A second conduit provides egress of the evaporated refrigerant from the expansion chamber, returning the evaporated refrigerant to the compressor. The first conduit has a smaller diameter than the second conduit and is placed coaxial with and within the second conduit. The coaxial arrangement of the first and second conduits serves two purposes. The evaporated coolant and the second conduit are heated through thermal contact with the first conduit containing pressurized liquid coolant having a higher temperature than the evaporated coolant, reducing the formation of condensation on the second conduit; and the pressurized refrigerant is pre-cooled prior to evaporation within the expansion chamber through thermal contact with the second conduit containing the evaporated coolant which has a lower temperature than the pressurized liquid coolant.

REFERENCES:
patent: 3609991 (1969-10-01), Chu et al.
patent: 3917370 (1975-11-01), Thornton et al.
patent: 4392362 (1983-07-01), Little
patent: 5144531 (1992-09-01), Go et al.

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