Joints and connections – Interfitted members – Assembled by plural manipulations of member
Reexamination Certificate
1999-12-27
2001-04-03
Browne, Lynne H. (Department: 3629)
Joints and connections
Interfitted members
Assembled by plural manipulations of member
C403S329000, C403S322400, C403S303000, C361S704000
Reexamination Certificate
active
06210068
ABSTRACT:
BACKGROUND OF THE INVENTION
1) Field of the Invention
The invention herein relates to a computer central processing unit (CPU) heat dissipation device latching structure comprised of a curved tensile latch element having a number of fastening holes of differing directional orientation and angular disposition to accommodate alignment with and coupling to the mounting pins of the present invention for the easy and rapid assembly of the heat dissipation device to the CPU.
2) Description of the Prior Art
Due to the continuous development of computer technology as well as integrated circuit production technology, central processing unit (CPU) execution and efficiency rates are becoming faster. As CPU execution speed increases, greater amounts of heat are produced and if CPU heat is not dissipated rapidly, computer operating stability will be adversely affected. To solve CPU overheating problems, the most direct and simplest approach is to additionally install a heat dissipation device on the CPU so that the high temperature currents produced by the CPU are diffused by the heat dissipation device to maintain CPU operating stability. Among the commonly available products at present, the conventional heat dissipation device shown in FIG.
1
and
FIG. 2
is comprised of a fan and heat sink assembly, wherein the fan
11
is screw fastened to the top cover
12
of the heat sink
10
, the mounting pins
15
of the heat sink
10
are inserted through the mounting holes
21
of the CPU board
20
, and a spring clip
30
is then secured to the mounting pins
15
, thereby holding the bottom plate
14
of the heat sink
10
tightly against the CPU
22
such that when the CPU
22
is operating, the high temperatures currents generated are diffused due to the air flow induced by the fan
11
through the fin area
13
of the heat sink
11
. However, since the structure of the spring clip
30
, as indicated in
FIG. 1
, is tile-like and consists of positioning grooves
31
indented laterally along each of the two sides, the outer edges of which are insertion fastened against the mounting pins
15
, quality is difficult to control; for example, the unit may dislodge if not tightly fastening or squeezed due to forceful impact. Another variety presently available in the market, as indicated in
FIG. 3
, is a pull-type tensile fastening element
40
which is inconvenient due to the application of force involved during installation in that the thumb and index finger must grasp and pull the handle
41
and injury results if sufficient caution is not exercised and, furthermore, its excessively large physical dimensions not only wastes material and space, but also crowds other computer components.
In view of the various drawbacks in the design of the said conventional heat dissipation attachment structures that lead to numerous disadvantages in terms of practicality and installation, the inventor of the invention herein, based on long experience in electronic hardware production and technology, conducted research to find solutions to the said drawbacks which, following continuous research and refinements, culminated in the successful development of the computer central processing unit (CPU) heat dissipation device latching structure of the invention herein that is capable of eliminating the many shortcomings of the prior art technology.
The computer central processing unit (CPU) heat dissipation device latching structure of the invention herein is comprised of a curved rectangular tensile latch element of a one-piece punch fabricated design having four fastening holes formed in the tensile latch element for alignment with and coupling to the mounting pins; situated proximal to the four corners of a frame plate, each fastening hole consists of a slide positioning slot and a locating opening such that its profile is narrower at one end and gradually widens to terminate as a larger circular opening, of which the fastening hole (the first fastening hole) at the lower left corner of the frame plate faces the right by design and serves as a fastening hole center point, i.e., the locating opening faces the right; the fastening hole (the second fastening hole) at the upper left corner faces the right, however, its slide positioning slot is lengthier than that of the first fastening hole to enable the rotation of the tensile latch element; the fastening hole (the third fastening hole) at the upper right corner is situated in a section protruding upward from the frame plate and, furthermore, faces the left at an angle of approximately 45 degrees, thereby allowing for the alignment of the tensile latch element by rotation in coordination with the fastening hole (the fourth fastening hole) at the lower left corner and having a locating opening facing upward by design, which thereby enables the tensile latch element to be rapidly coupled tightly to the mounting pins by rotation alone without requiring forceful pushing, pulling, or squeezing. During installation, it is only necessary to insert the mounting pins into the first fastening hole and the second fastening hole, then, taking the first fastening hole as a center point, the tensile latch element is rotated to the right until it is postured at an angle, at which time the locating openings of the third fastening hole and the fourth fastening hole are aligned with the mounting pins and, after the tensile latch element is pushed downward, the mounting pins are inserted into the locating openings of the third fastening hole and fourth fastening hole, and then it is rotated to the left until secured into position, which completes the assembly of the heat dissipation device to the computer CPU. Furthermore, a projecting wave-shaped press section is situated in between the third fastening hole and the fourth fastening hole of the invention herein to increase frictional grip and facilitate rotation such that when the installer aligns and rotates the tensile latch element during installation, the tensile latch element is easily and stably turned around, with no injury to the installer.
SUMMARY OF THE INVENTION
Therefore, the primary objective of the invention herein is to provide a computer central processing unit (CPU) heat dissipation device latching structure comprised of a one-piece punch fabricated curved rectangular tensile latch element that secures a heat dissipation device to the CPU; formed in the said tensile latch element are fastening holes that match the positions of the mounting holes in the CPU board, while also being capable of being coupled to the aligned mounting pins by utilizing the differing directional orientations and angular dispositions of the four locating openings of the fastening holes for rotation and alignment to easily and rapidly install the heat dissipation device tightly against the computer CPU.
Another objective of the invention herein is to provide a computer central processing unit (CPU) heat dissipation device latching structure having a press section situated in between the third fastening hole and the fourth fastening hole to enable the easy and stable rotation of the tensile latch element and thereby prevent injury.
In achieving the said objectives of the invention herein, the technological means and overall structural innovations are disclosed to demonstrate the most feasible embodiments and, furthermore, the brief description of the drawings below and the following detailed description of the invention will enable a further understanding of the present invention.
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patent: 4648737 (1987-03-01), Lake, Jr. et al.
patent: 5232303 (1993-08-01), Rubner
patent: 5662163 (1997-09-01), Mira
patent: 5959838 (1999-09-01), Liang
patent: 5973921 (1999-10-01), Lin
patent: 5982622 (1999-11-01), Chiou
patent: 6008990 (1999-12-01), Liu
patent: 6055159 (2000-04-01), Sun
patent: 6097601 (2000-08-01), Lee
patent: 6104609 (2000-08-01), Chen
Bochna David E.
Browne Lynne H.
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