Compressive pedestal for microminiature connections

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427259, 427265, 427266, 437228, B05D 512

Patent

active

047160497

ABSTRACT:
Apparatus is disclosed for providing microelectronic, intra-chip and chip-to-chip interconnections in an ultra-dense integrated circuit configuration. Compressive pedestals 20 are used to form spring-loaded electrical and mechanical interconnections to conductive terminals on a chip interface mesa and chip assembly 28 in order to form a large multi-chip array 23 on an interconnection substrate 24. Methods are also disclosed for fabricating the compressive pedestals 20.

REFERENCES:
patent: 3436605 (1969-04-01), Landran
patent: 3811186 (1974-05-01), Larnerd
patent: 4372809 (1983-02-01), Grewal
patent: 4526859 (1985-07-01), Christensen
patent: 4574031 (1986-03-01), Dorey

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