Compression loaded semiconductor device

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Details

357 81, 357 74, 357 38, H01L 2342

Patent

active

049566962

ABSTRACT:
A compression loaded semiconductor device package (40) in accordance with the invention includes a cylindrical semiconductor device (54) having a first region (66) on a first face, a control region (68) on the first face having a central portion (70) and a plurality of projections (72) extending radially from the central portion with the radial projections being symmetrically disposed around the periphery of the first face and a second region (74) on a second face with the second face being opposed to the first face; an electrically conductive contract (48) having an external control terminal (88), an annulus (84) electrically connected to the external control terminal, a plurality of projections (82) electrically connected to the annulus, projecting radially inward and a center (80) electrically connected to the radially inward projections and to the control region; and first and second annular insulators (112 and 114) each insulator having a plurality of faces, the upper cover being bonded to a first face (116) of the first insulator, a second face of the first insulator being bonded to a first attachment ring (122) with the first attachment ring being bonded to the annulus, the lower cover being bonded to a first face (116) of the second insulator, a second face (118) of the second insulator being bonded to a second attachment ring (124) with the second attachment ring being bonded to the annulus, the bonds (120) defining a sealed chamber containing the semiconductor device.

REFERENCES:
patent: 3536966 (1970-10-01), Lewis
patent: 3931635 (1976-01-01), Sundstrom
patent: 3992717 (1976-11-01), Rice
patent: 4188637 (1980-02-01), Gerstenkoper et al.
patent: 4305087 (1981-12-01), Wislocky
patent: 4554574 (1985-11-01), Wright
patent: 4607275 (1986-08-01), Vogt et al.
patent: 4710795 (1987-12-01), Nippert et al.

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