Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1995-06-07
1997-05-27
Whitehead, Carl W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257678, 257698, H01L 2304, H01L 2302
Patent
active
056335318
ABSTRACT:
A compression glass lead-in arrangement in a metal body, especially in metal housings for semiconductors, in particular integrated circuits. The lead-through arrangements hermetically seal the interior of the housing relative to the environment. A glass bead is fused into a bore in the housing and the connecting conductor of the integrated circuit is passed outwardly through the glass. Alloys of the systems Cu, Al and Mg, during a cooling phase after the fusing-in exhibit a hardening effect which provides that in conjunction with the alloys, it is possible to produce compression glass lead-in arrangements which possess a hermetic sealing integrity even after a high degree of thermal and/or mechanical loading, have a high resistance to fluctuations in temperature and good resistance to corrosion.
REFERENCES:
patent: 4128697 (1978-12-01), Simpson
patent: 4142918 (1979-03-01), Plewes
patent: 4309507 (1982-01-01), Davis et al.
patent: 4349635 (1982-09-01), Davis et al.
patent: 4678358 (1987-07-01), Layher
patent: 4805009 (1989-02-01), Pryor et al.
R. Lomerson, "Batch-Made Package Hold Dense IC's, Save Space, Survive Tough Environments", Electronics, Bd. 56, Nr. 8, pp. 155-159 (1983).
Findl Walter
Hornig Wolfgang
Diehl GmbH & Co.
Electrovac, Fabrikation elektrotechnischer Spezialartikel Gesell
Whitehead Carl W.
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