Compression glass lead-in arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257678, 257698, H01L 2304, H01L 2302

Patent

active

056335318

ABSTRACT:
A compression glass lead-in arrangement in a metal body, especially in metal housings for semiconductors, in particular integrated circuits. The lead-through arrangements hermetically seal the interior of the housing relative to the environment. A glass bead is fused into a bore in the housing and the connecting conductor of the integrated circuit is passed outwardly through the glass. Alloys of the systems Cu, Al and Mg, during a cooling phase after the fusing-in exhibit a hardening effect which provides that in conjunction with the alloys, it is possible to produce compression glass lead-in arrangements which possess a hermetic sealing integrity even after a high degree of thermal and/or mechanical loading, have a high resistance to fluctuations in temperature and good resistance to corrosion.

REFERENCES:
patent: 4128697 (1978-12-01), Simpson
patent: 4142918 (1979-03-01), Plewes
patent: 4309507 (1982-01-01), Davis et al.
patent: 4349635 (1982-09-01), Davis et al.
patent: 4678358 (1987-07-01), Layher
patent: 4805009 (1989-02-01), Pryor et al.
R. Lomerson, "Batch-Made Package Hold Dense IC's, Save Space, Survive Tough Environments", Electronics, Bd. 56, Nr. 8, pp. 155-159 (1983).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Compression glass lead-in arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compression glass lead-in arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compression glass lead-in arrangement will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2331313

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.