Compression connection for vertical IC packages

Details Compression connection for vertical IC packages Compression connection for vertical IC packages

2007-03-01

2008-11-04

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S688000, C361S704000, C361S807000, C257S341000, C257S692000, C257S778000

Reexamination Certificate

active

07447041

ABSTRACT:
An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.

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