Compression bonding device and a mounting method

Details Compression bonding device and a mounting method Compression bonding device and a mounting method

2008-07-11

2010-06-15

Tucker, Philip C (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S306900, C156S307100

Reexamination Certificate

active

07736459

ABSTRACT:
A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by the dam member and the surface of the bonding part does not horizontally extend. As a result of the absence of horizontal extension of the bonding part, electric components of the object to be pressed are not subjected to a force that horizontally moves the electric components and the electric components are vertically pressed downward and connected to the terminals of the substrate. Thus, an electric device having high connection reliability is obtained.

REFERENCES:
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patent: WO 2005/006430 (2005-01-01), None
patent: WO 2007/080956 (2007-07-01), None

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