Compounding mica and resin with particulate heat sensitive addit

Details Compounding mica and resin with particulate heat sensitive addit Compounding mica and resin with particulate heat sensitive addit

1979-12-13

1981-12-08

Marquis, Melvyn I.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 4214, C08L 9100

Patent

active

043046991

ABSTRACT:
A method of rapidly compounding melt forming resin (such as polypropylene) mica, and heat sensitive additives, such as chlorinated waxes, which comprises providing a molten mass of the resin, introducing the mica and heat sensitive additive into the molten resin and kneading the so introduced mica and additive to provide admixture thereof. The compounding is rapid and at optimal temperature.

REFERENCES:
patent: 3453356 (1969-07-01), Kent, Jr. et al.
Titow et al., Reinforced Plastics, (1975), pp. 125-136.

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