Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-01-24
1999-03-23
Aftergut, Jeff H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156148, 156181, 442367, 442368, 442369, B32B 512
Patent
active
058853995
ABSTRACT:
Compound threads (1) and the fabrics obtained therefrom are very inexpensive, of acceptable quality and preferably useable to make recyclable disposable garments. The threads (1) include a thin carrier thread (2) to which a web mass (3), coming from the carding of the fiber used, is adhered, preferably by use of a water-soluble glue or electrostatic means. The compound thread (1) has the possibility of making use, upon making the web (3), of the shortest fibrils that are usually disposed of. One of the fabrics obtained consists of a band or strip of web (3) that includes several carrier threads (2) placed parallel to each other and that can be cut to obtain compound threads (1.) Another fabric consists of weft thread and crossed warp thread of which all or some, depending on the different combinations, are compound threads (1.)
REFERENCES:
patent: 2521055 (1950-09-01), Foster
patent: 2731066 (1956-01-01), Hagendobler et al.
patent: 2805959 (1957-09-01), Ewing
patent: 2902395 (1959-09-01), Hirschy et al.
patent: 3816231 (1974-06-01), Marshall
patent: 3835638 (1974-09-01), Mayer et al.
patent: 3930091 (1975-12-01), Lewis et al.
patent: 5219633 (1993-06-01), Sabee
Caballero Rodriguez Antonio
Marti Andres Leopoldo
Aftergut Jeff H.
TT IU, S.L.
LandOfFree
Compound threads, fabrics provided therefrom and process to obta does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Compound threads, fabrics provided therefrom and process to obta, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compound threads, fabrics provided therefrom and process to obta will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2121692