Compound storage unit for a molding process

Details Compound storage unit for a molding process Compound storage unit for a molding process

2005-07-13

2008-10-21

Davis, Robert B (Department: 1791)

Plastic article or earthenware shaping or treating: apparatus

With apparatus assembly or dismantling means or with idle part

Means permitting removal or substitution of elements during...

C425S19200R, C425S449000

Reexamination Certificate

active

07438549

ABSTRACT:
The invention relates to a compound storage unit (1) for a molding process, in particular for producing lipsticks comprising a container (2) for moldable compounds, wherein said container consists of a housing (3), a heating device (4) which heats the moldable compounds and disposed in the housing (3) of the container (2), a mixing device (5) for mixing the heated compounds in the container (2), a dispenser device (6) for extracting the compounds from the container (2), a fixing device (7) for removably fixing the container (2)to a molding device (20) for molding the compounds and a corresponding molding device20) for molding compounds by means of a mould, a corresponding molding system and a transport carriage (30). The aim of the invention is to develop a storage unit and a molding device which make it possible to substantially reduce the standstill time of the molding device for exchanging the moldable compound.

REFERENCES:
patent: 2263302 (1941-11-01), Johnson
patent: 5780018 (1998-07-01), Collins et al.
patent: 6273215 (2001-08-01), Horan et al.
patent: 6962271 (2005-11-01), Gregson, Jr.

Affiliated with

Also associated with

Rating

Compound storage unit for a molding process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compound storage unit for a molding process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compound storage unit for a molding process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3998663