Compound semiconductor wafer and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Light responsive structure

Reexamination Certificate

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Details

C257S613000, C257SE31022, C257SE31059, C438S057000

Reexamination Certificate

active

10514973

ABSTRACT:
A compound semiconductor wafer providing an InGaAs light receiving layer having superior crystal characteristic suitable for a near-infrared sensor includes an InAsxP1-xgraded buffer layer consisting of a plurality of layers positioned on an InP substrate and an InAsyP1-ybuffer layer positioned on the graded buffer layer, sandwiched between said InP substrate and the InGaAs layer, wherein maximum value of PL light emission intensity at an interface of each of the layers of the graded buffer layer and the buffer layer is, at every interface, smaller than 3/10 of the maximum PL light emission intensity of the buffer layer.

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Linga et al., “Dark current Analysis and characterization of InxGa1-xAs/InAsyP1-y Graded Photodiodes with X>0.53 for Reponse to Longer Wavelengths (>1.7 p m)” JouRNAL of Lightwave Technology, vol. 10, No. 8, Aug. 1992, pp. 1050-1054.
Krishna R. Linga et al., “Dark Current Analysis and Characterization on InxGa1−xAs / InAsyP1−yGraded Photodiodes with X>0.53 for Reponse to Longer Wavelengths (>1.7 μm)”, Journal of Lightwave Technology, vol. 10, No. 8, Aug. 1992, pp. 1050 to 1054.
Isamu Akasaki; “Advanced Electronics Series I-1 Group III-V Compound Semiconductor”; Baifukan Co., Ltd.; May 20, 1994; First Edition; p. 85; Partial English Translation.

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