Compound laminate for printed circuit boards

Details Compound laminate for printed circuit boards Compound laminate for printed circuit boards

1998-09-10

2000-11-07

Hess, Bruce H.

Stock material or miscellaneous articles

Composite

Of epoxy ether

428415, 428416, 428426, 442241, 442255, B32B 2738

Patent

active

061434140

ABSTRACT:
It includes two outer sheets of continuous-strand fiberglass fabric and a core of non-woven fiberglass formed by sheets of fiberglass paper, all sheets being impregnated with epoxy resin, and presenting at least one sheet of conducting material, on one or both outer sides; it is characterized in that it incorporates in the non-woven fiberglass core at least one intermediate sheet of fiberglass fabric impregnated with resin.
It allows manufacturing of reliable printed circuits, even when using surface-mounted components, while at the same time its cost is relatively low; it is particularly suitable for the field of consumer and semi-professional electronics.

REFERENCES:
patent: 3393117 (1968-07-01), Zolg et al.
patent: 3617613 (1971-11-01), Benzinger et al.

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