Compound injection molded high pressure laminate flooring

Static structures (e.g. – buildings) – Composite prefabricated panel including adjunctive means – Having separate attached – elongated edging or stiffener

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C052S391000, C052S309800, C052S309100, C052S783100

Reexamination Certificate

active

07104025

ABSTRACT:
The invention relates to a method for fabricating a decorative laminate panel, wherein the decorative laminate panel includes a decorative laminate layer and a core. The method is achieved by forming a decorative laminate of a predetermined size, placing the decorative laminate within a die cavity, injection molding the core within the die cavity while the decorative laminate remains within the die cavity to form a decorative laminate panel and releasing the formed decorative laminate panel from the die cavity. The invention further relates to a decorative laminate panel manufactured in accordance with the method defined above and a unitary edge profile member adapted for use in the fabrication of a compound injection molded decorative laminate panel.

REFERENCES:
patent: 2717187 (1955-09-01), Morgan et al.
patent: 3907624 (1975-09-01), Gravely, Jr.
patent: 4032751 (1977-06-01), Youtsey et al.
patent: 4078959 (1978-03-01), Palfey et al.
patent: 4263247 (1981-04-01), Berger et al.
patent: 4315967 (1982-02-01), Prior et al.
patent: 4622191 (1986-11-01), Takeuchi
patent: 4625491 (1986-12-01), Gibson
patent: 4746560 (1988-05-01), Goeden
patent: 4818590 (1989-04-01), Prince et al.
patent: 4832995 (1989-05-01), McLauchlin
patent: 4864789 (1989-09-01), Thorn
patent: 5348778 (1994-09-01), Knipp et al.
patent: 5413661 (1995-05-01), Spengler et al.
patent: 5440846 (1995-08-01), Record
patent: 5469903 (1995-11-01), Stanley
patent: 5638651 (1997-06-01), Ford
patent: 5741454 (1998-04-01), Polidori
patent: 5876543 (1999-03-01), Kinpara et al.
patent: 5904886 (1999-05-01), Stecker
patent: 5989668 (1999-11-01), Nelson et al.
patent: 6012787 (2000-01-01), Jennings et al.
patent: 6117384 (2000-09-01), Laurin et al.
patent: 6150026 (2000-11-01), Furuya et al.
patent: 6287678 (2001-09-01), Spengler
patent: 6308491 (2001-10-01), Porter
patent: 6428738 (2002-08-01), Winget et al.
patent: 6446413 (2002-09-01), Gruber
patent: 6725624 (2004-04-01), Hirath et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Compound injection molded high pressure laminate flooring does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compound injection molded high pressure laminate flooring, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compound injection molded high pressure laminate flooring will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3567921

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.