Compound for patching voids in a semi-conductive component of in

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174102SC, 174105SC, 174120SC, H01B 106

Patent

active

041705750

ABSTRACT:
The mending of defective semiconductive components of insulated electrical cable, comprising filling and sealing voids or breaks within a body of semiconductive material with a curable semiconductive patching compound comprising the combination of chlorosulfonated polyethylene, conductive filler and lauroyl peroxide, and heating the patching compound to cure the same.

REFERENCES:
patent: 3079370 (1963-02-01), Precopio et al.
patent: 3201503 (1965-08-01), Benning et al.
patent: 3541228 (1970-11-01), Lombardi
patent: 3661877 (1972-05-01), Bluestein et al.
patent: 3793476 (1974-02-01), Misiura et al.
Condensed Chemical Dictionary (8th Ed.), Gessner G. Hawley, (1974), p. 506.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Compound for patching voids in a semi-conductive component of in does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compound for patching voids in a semi-conductive component of in, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compound for patching voids in a semi-conductive component of in will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1964820

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.