Compound angled pad end-effector

Details Compound angled pad end-effector Compound angled pad end-effector

2006-05-23

2006-05-23

Lillis, Eileen D. (Department: 3652)

Handling: hand and hoist-line implements

Contact lens applicator

C294S902000, C901S030000, C414S941000, C414S935000

Reexamination Certificate

active

07048316

ABSTRACT:
This invention provides a method and a support device for a wafer transfer process which has a first vertical, second horizontal and third compound angled surfaces, as well as a pair of sidewalls all contiguously connected to one another. The third surface has at least two angled receiving surfaces whereby one of such angled receiving surfaces has a small angle of incline for initially receiving and delivering a wafer. The other angled receiving surface has a steep angle of incline for effectively receiving, holding and transporting a semiconductor wafer by increasing an effective coefficient of friction of the wafer to provide a secure resting point for such wafer during a transfer process while simultaneously increasing the speed thereof. Furthermore, a hole may be provided in the support device for attaching the support device, or a plurality of support devices having holes, to an end-effector.

REFERENCES:
patent: 5669644 (1997-09-01), Kaihotsu et al.
patent: 6318957 (2001-11-01), Carr et al.
patent: 6537011 (2003-03-01), Wang et al.
patent: 6634686 (2003-10-01), Hosokawa
patent: 6709218 (2004-03-01), Freerks et al.
patent: 6729834 (2004-05-01), McKinley
patent: 2002/0041102 (2002-04-01), Krauskopf et al.
patent: 2002/0071756 (2002-06-01), Gonzalez
patent: 2003/0085582 (2003-05-01), Woodruff et al.

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