Compositions of materials for forming protective film in semicon

Details Compositions of materials for forming protective film in semicon Compositions of materials for forming protective film in semicon

1983-06-06

1985-02-05

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524173, 524167, 524233, 528 26, 528 38, 174110S, 174110SR, 174110N, C08K 534

Patent

active

044979223

ABSTRACT:
A composition of materials comprising a polyamide acid-silicone intermediate obtained by reacting (a) a diaminoamide compound of the formula: ##STR1## wherein Ar and Y are as defined in the specification, (b) a diaminosiloxane, (c) a diamine, and (d) an aromatic tetracarboxylic acid dianhydride can form a protective film used in a semiconductor device excellent in adhesive properties, heat resistance and preventing soft errors due to .alpha.-rays.

REFERENCES:
patent: 4338426 (1982-07-01), Sato et al.
patent: 4395527 (1983-07-01), Berger

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